A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces
A Standard patent application filed on 14 October 2003 credited to Obeng, Yaw S.

Details

Application number :
2003282852  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
A corrosion retarding polishing slurry for the chemical mechanical polishing of copper surfaces  
Inventor :
Obeng, Yaw S.  
Agent name :
 
Address for service :
 
Filing date :
14 October 2003  
Associated companies :
 
Applicant name :
PSILOQUEST, INC.  
Applicant address :
6901 TPC Boulevard, Suite 650, Orlando, FL 32822  
Old name :
 
Original Source :
Go  

Same Inventor