Thermal management with filled polymeric polishing pads and applications therefor
A Standard patent application filed on 31 October 2002 credited to Obeng, Yaw S. ; Yokley, Edward M.

Details

Application number :
2002343600  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Thermal management with filled polymeric polishing pads and applications therefor  
Inventor :
Obeng, Yaw S. ; Yokley, Edward M.  
Agent name :
 
Address for service :
 
Filing date :
31 October 2002  
Associated companies :
 
Applicant name :
OBENG, Yaw, S.  
Applicant address :
272 Lytton Circle, Orlando, FL 32824  
Old name :
 
Original Source :
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Same Inventor