Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
A Standard patent application filed on 28 March 2001 credited to Boyd, John M.

Details

Application number :
2001249535  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path  
Inventor :
Boyd, John M.  
Agent name :
 
Address for service :
 
Filing date :
28 March 2001  
Associated companies :
 
Applicant name :
Lam Research Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor