High speed interconnect
A Standard patent application filed on 26 January 2001 credited to Sharf, Alexander Michael ; Morgan, Chad William ; Helster, David Wayne ; Defibaugh, George Richard ; Mickievicz, Scott Keith ; Fedder, James Lee ; Consoli, John Joseph ; Sipe, Lynn Robert ; Mcalonis, Matthew Richard ; Andrews Jr., Howard Wallace

Details

Application number :

2001229771  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High speed interconnect  

Inventor :

Sharf, Alexander Michael ; Morgan, Chad William ; Helster, David Wayne ; Defibaugh, George Richard ; Mickievicz, Scott Keith ; Fedder, James Lee ; Consoli, John Joseph ; Sipe, Lynn Robert ; Mcalonis, Matthew Richard ; Andrews Jr., Howard Wallace  

Agent name :

 

Address for service :

 

Filing date :

26 January 2001  

Associated companies :

 

Applicant name :

Tyco Electronics Corporation  

Applicant address :

 

Old name :

 

Original Source :

Go  

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