Optical/electrical interconnects and package for high speed signaling
A Standard patent application filed on 07 August 2002 credited to Li, Yuang-Liang

Details

Application number :

2002362250  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Optical/electrical interconnects and package for high speed signaling  

Inventor :

Li, Yuang-Liang  

Agent name :

 

Address for service :

 

Filing date :

07 August 2002  

Associated companies :

 

Applicant name :

INTEL CORPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

Go  

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