High speed, high density interconnection device
A Standard patent application filed on 24 June 2003 credited to Langon, Alfred J.
;
Saydam, Erol D.
;
Prew, Raymond A.
;
Perugini, Michael
;
Eastman, Gary D.
Details
Application number :
2003249355
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
High speed, high density interconnection device
Inventor :
Langon, Alfred J.
;
Saydam, Erol D.
;
Prew, Raymond A.
;
Perugini, Michael
;
Eastman, Gary D.
Agent name :
Address for service :
Filing date :
24 June 2003
Associated companies :
Applicant name :
ADVANCED INTERCONNECTIONS CORPORATION
Applicant address :
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893-0919