Three dimensional, high speed back-panel interconnection system
A Standard patent application filed on 25 April 2003 credited to Lemke, Timothy A.

Details

Application number :

2003234253  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Three dimensional, high speed back-panel interconnection system  

Inventor :

Lemke, Timothy A.  

Agent name :

 

Address for service :

 

Filing date :

25 April 2003  

Associated companies :

 

Applicant name :

BROADSIDE TECHNOLOGY, LLC  

Applicant address :

1709 Edgar Lane, Camp Hill, PA 17011  

Old name :

 

Original Source :

Go  

Same Inventor

• Low profile connector
• High density connector and method of manufacture
• Low profile connector
• High density connector and method of manufacture
• High speed, controlled impedance air dielectric electronic...