Microelectronics package
A Standard patent application filed on 11 April 1997 credited to Wein, Deborah S.
;
Anderson, Paul M.
;
Babiarz, Joseph
;
Goetz, Martin
;
Lindner, Alan W.
Details
Application number :
26655
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Microelectronics package
Inventor :
Wein, Deborah S.
;
Anderson, Paul M.
;
Babiarz, Joseph
;
Goetz, Martin
;
Lindner, Alan W.