Integrated core microelectronic package
A Standard patent application filed on 29 August 2001 credited to Li, Jian ; Henao, Maria ; Mu, Xiao-Chun ; Vu, Quat ; Ma, Qing

Details

Application number :

2001288510  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Integrated core microelectronic package  

Inventor :

Li, Jian ; Henao, Maria ; Mu, Xiao-Chun ; Vu, Quat ; Ma, Qing  

Agent name :

 

Address for service :

 

Filing date :

29 August 2001  

Associated companies :

 

Applicant name :

Intel Corporation  

Applicant address :

 

Old name :

 

Original Source :

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