High frequency microelectronics package
A Standard patent application filed on 11 April 1997 credited to Wein, Deborah S. ; Anderson, Paul M. ; Going, Timothy ; Goetz, Martin ; Babiarz, Joseph ; Lindner, Alan W.

Details

Application number :

24473  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High frequency microelectronics package  

Inventor :

Wein, Deborah S. ; Anderson, Paul M. ; Going, Timothy ; Goetz, Martin ; Babiarz, Joseph ; Lindner, Alan W.  

Agent name :

 

Address for service :

 

Filing date :

11 April 1997  

Associated companies :

 

Applicant name :

Stratedge Corporation  

Applicant address :

 

Old name :

 

Original Source :

Go