Microelectronic packaging and components
A Standard patent application filed on 27 November 2003 credited to Dukhovny, Leonid
;
Furer, Lev
;
Mirsky, Uri
;
Neftin, Shimon
;
Sezin, Nina
Details
Application number :
2003286390
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Microelectronic packaging and components
Inventor :
Dukhovny, Leonid
;
Furer, Lev
;
Mirsky, Uri
;
Neftin, Shimon
;
Sezin, Nina
Agent name :
Address for service :
Filing date :
27 November 2003
Associated companies :
Applicant name :
MICRO COMPONENTS LTD
Applicant address :
Ramat Gabriel Industrial Park, Park Ashkfar Building 4, POBox 470, 23000 Migdal Ha'emek