Apparatus and method for endpoint detection and monitoring for chemical mechanical polishing operations
A Standard patent application filed on 23 April 2003 credited to Mautz, Karl E.
Details
Application number :
2003225113
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Apparatus and method for endpoint detection and monitoring for chemical mechanical polishing operations
Inventor :
Mautz, Karl E.
Agent name :
Address for service :
Filing date :
23 April 2003
Associated companies :
Applicant name :
FREESCALE SEMICONDUCTOR, INC.
Applicant address :
6501 William Cannon Drive West, Austin,TX 78735 USA