Details

Application number :
2002349419  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Plasma etching method and plasma etching device  
Inventor :
Hayashi, Hisataka ; Nagaseki, Kazuya ; Matsuyama, Shoichiro ; Honda, Masanobu ; Inazawa, Koichiro  
Agent name :
 
Address for service :
 
Filing date :
04 December 2002  
Associated companies :
 
Applicant name :
KABUSHIKI KAISHA TOSHIBA  
Applicant address :
1-1, Shibaura 1-chome, Minato-ku, Tokyo 105-8001  
Old name :
 
Original Source :
Go  

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