Low dielectric constant materials with improved thermal and mechanical properties
A Standard patent application filed on 15 October 1998 credited to Lee, Chung J
;
Foggiato, Giovanni Antonio
;
Wang, Hui
Details
Application number :
10923
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Low dielectric constant materials with improved thermal and mechanical properties
Inventor :
Lee, Chung J
;
Foggiato, Giovanni Antonio
;
Wang, Hui