Apparatus and methods of reinforcement of lead bonding in microelectronic packages
A Standard patent application filed on 28 July 2000 credited to Jiang, Tongbi

Details

Application number :
66132  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Apparatus and methods of reinforcement of lead bonding in microelectronic packages  
Inventor :
Jiang, Tongbi  
Agent name :
 
Address for service :
 
Filing date :
28 July 2000  
Associated companies :
 
Applicant name :
Micron Technology, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor