Details

Application number :
27244  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Attaching a semiconductor to a substrate  
Inventor :
Jiang, Tongbi ; Schrock, Edward A.  
Agent name :
 
Address for service :
 
Filing date :
11 January 2000  
Associated companies :
 
Applicant name :
Micron Technology, Inc.  
Applicant address :
 
Old name :
 
Original Source :
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