Details
- Application number :
- 2002243722
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Electronic device package
- Inventor :
- Du, Yong
;
Jiang, Tongbi
- Agent name :
-
- Address for service :
-
- Filing date :
- 01 February 2002
- Associated companies :
-
- Applicant name :
- MICRON TECHNOLOGY, INC.
- Applicant address :
- 8000 South Federal Way, Boise, ID 83716-9632
- Old name :
-
- Original Source :
- Go