Electronic device sealing resin compositions and sealed electronic devices
A Standard patent application filed on 02 October 1990 credited to Sakaguchi, Yasuo
;
Suzuki, Keiichiro
Details
Application number :
63724
Application type :
Standard
Application status :
CEASED
Under opposition :
No
Proceeding type :
Invention title :
Electronic device sealing resin compositions and sealed electronic devices
Inventor :
Sakaguchi, Yasuo
;
Suzuki, Keiichiro
Agent name :
Address for service :
Filing date :
02 October 1990
Associated companies :
Applicant name :
Kureha Kagaku Kogyo K.K.
Applicant address :
1-9-11, Nihonbashi Horidome-cho, Chuo-ku, Tokyo 103, Japan