Details
- Application number :
- 51923
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Cyclopentylene compounds and intermediates therefor, epoxy resin composition, molding material, and resin-sealed electronic device
- Inventor :
- Sue, Haruaki
;
Hagiwara, Shinsuke
;
Yokoyama, Hideki
;
Akagi, Seiichi
;
Kobayashi, Akihiro
;
Furusawa, Fumio
- Agent name :
-
- Address for service :
-
- Filing date :
- 01 December 1997
- Associated companies :
-
- Applicant name :
- Hitachi Chemical Company, Ltd.
- Applicant address :
-
- Old name :
-
- Original Source :
- Go