Phase-separation structure, resin composition comprising said structure, molding material for sealing electronic component, and electronic component device
A Standard patent application filed on 08 October 1997 credited to Hagiwara, Shinsuke ; Kuwano, Atsushi

Details

Application number :

45712  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Phase-separation structure, resin composition comprising said structure, molding material for sealing electronic component, and electronic component device  

Inventor :

Hagiwara, Shinsuke ; Kuwano, Atsushi  

Agent name :

 

Address for service :

 

Filing date :

08 October 1997  

Associated companies :

 

Applicant name :

Hitachi Chemical Company, Ltd.  

Applicant address :

 

Old name :

 

Original Source :

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