Transfer of a thin layer from a wafer comprising a buffer layer
A Standard patent application filed on 09 July 2003 credited to Osternaud, Benedicte
;
Aulnette, Cecile
;
Ghyselen, Bruno
Details
Application number :
2003250462
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Transfer of a thin layer from a wafer comprising a buffer layer
Inventor :
Osternaud, Benedicte
;
Aulnette, Cecile
;
Ghyselen, Bruno
Agent name :
Address for service :
Filing date :
09 July 2003
Associated companies :
Applicant name :
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
Applicant address :
Parc Technologique des Fontaines, Chemin des Franques, F-38190 Bernin