Transfer of a thin layer from a wafer comprising a buffer layer

Application number :: 2003249475
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Transfer of a thin layer from a wafer comprising a buffer layer
Inventor :: Osternaud, Benedite ; Daval, Nicolas ; Aulnette, Cecile ; Ghyselen, Bruno
Agent name :
Address for service :
Filing date :: 09 July 2003
Associated companies :
Applicant name :: S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES
Applicant address :: Parc Technologique des Fontaines, Chemin des Franques, F-38190 Bernin
Old name :
Original Source :: Go

Transfer of a thin layer from a wafer comprising a buffer layer A Standard patent application filed on 09 July 2003 credited to Osternaud, Benedite ; Daval, Nicolas ; Aulnette, Cecile ; Ghyselen, Bruno