High density connector and method of manufacture
A Standard patent application filed on 10 October 1997 credited to Houtz, Timothy W.
;
Lemke, Timothy A.
Details
Application number :
48156
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
High density connector and method of manufacture
Inventor :
Houtz, Timothy W.
;
Lemke, Timothy A.
Agent name :
Davies Collison Cave
Address for service :
GPO Box 3876 SYDNEY NSW 2001
Filing date :
10 October 1997
Associated companies :
Applicant name :
FCI Connectors Singapore Pte Ltd
Applicant address :
138 Robinson Road #17-00 The Corporate Office, Singapore 068906, Singapore
Old name :
Berg Technology, Inc.
;
Connector Systems Technology N.V.