High density connector and method of manufacture
A Standard patent application filed on 07 October 1997 credited to Houtz, Timothy W. ; Lemke, Timothy A.

Details

Application number :

51454  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High density connector and method of manufacture  

Inventor :

Houtz, Timothy W. ; Lemke, Timothy A.  

Agent name :

 

Address for service :

 

Filing date :

07 October 1997  

Associated companies :

 

Applicant name :

Berg Technology, Inc.  

Applicant address :

 

Old name :

 

Original Source :

Go  

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