Chemical mechanical polishing slurry for semiconductor integrated circuit, polishing method and semiconductor integrated circuit
A Standard patent application filed on 28 June 2002 credited to Shinmaru, Sachie ; Tsugita, Katsuyuki

Details

Application number :
2002315742  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Chemical mechanical polishing slurry for semiconductor integrated circuit, polishing method and semiconductor integrated circuit  
Inventor :
Shinmaru, Sachie ; Tsugita, Katsuyuki  
Agent name :
 
Address for service :
 
Filing date :
28 June 2002  
Associated companies :
 
Applicant name :
SEIMI CHEMICAL CO., LTD.  
Applicant address :
3-2-10, Chigasaki, Chigasaki-city, Kanagawa 253-8585  
Old name :
 
Original Source :
Go  

Same Inventor