Polishing agent composition for insulating film for semiconductor integrated circuit and method for manufacturing semiconductor integrated circuit
A Standard patent application filed on 05 September 2003 credited to Hayashi, Atsushi ; Shinmaru, Sachie ; Tsugita, Katsuyuki ; Kamitani, Hiroyuki

Details

Application number :

2003261966  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polishing agent composition for insulating film for semiconductor integrated circuit and method for manufacturing semiconductor integrated circuit  

Inventor :

Hayashi, Atsushi ; Shinmaru, Sachie ; Tsugita, Katsuyuki ; Kamitani, Hiroyuki  

Agent name :

 

Address for service :

 

Filing date :

05 September 2003  

Associated companies :

 

Applicant name :

ASAHI GLASS COMPANY, LIMITED  

Applicant address :

12-1, Yurakucho 1-chome, Chiyoda-ku, Tokyo 100-8405  

Old name :

 

Original Source :

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