Method of forming via metal layer and via metal layer- formed substrate
A Standard patent application filed on 26 June 2002 credited to Yuasa, Mitsuhiro

Details

Application number :
2002313268  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method of forming via metal layer and via metal layer- formed substrate  
Inventor :
Yuasa, Mitsuhiro  
Agent name :
 
Address for service :
 
Filing date :
26 June 2002  
Associated companies :
 
Applicant name :
TOKYO ELECTRON LIMITED  
Applicant address :
3-6, Akasaka 5-Chome, Minato-Ku, Tokyo 107-8481  
Old name :
 
Original Source :
Go  

Same Inventor