Apparatus and process for precise encapsulation of flip chip interconnects
A Standard patent application filed on 25 February 2002 credited to Pendse, Rajendra

Details

Application number :

2002237005  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Apparatus and process for precise encapsulation of flip chip interconnects  

Inventor :

Pendse, Rajendra  

Agent name :

 

Address for service :

 

Filing date :

25 February 2002  

Associated companies :

 

Applicant name :

CHIPPAC, INC.  

Applicant address :

47400 Kato Road, Fremont, California 94538  

Old name :

 

Original Source :

Go  

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