Details

Application number :
2002237005  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Apparatus and process for precise encapsulation of flip chip interconnects  
Inventor :
Pendse, Rajendra  
Agent name :
 
Address for service :
 
Filing date :
25 February 2002  
Associated companies :
 
Applicant name :
CHIPPAC, INC.  
Applicant address :
47400 Kato Road, Fremont, California 94538  
Old name :
 
Original Source :
Go  

Same Inventor