Chip scale package with flip chip interconnect
A Standard patent application filed on 25 February 2002 credited to Chen, Andrea ; Kim, Kyung-Moon ; Kweon, Young-Do ; Pendse, Rajendra ; Tam, Samuel ; Ahmad, Nazir

Details

Application number :

2002252098  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Chip scale package with flip chip interconnect  

Inventor :

Chen, Andrea ; Kim, Kyung-Moon ; Kweon, Young-Do ; Pendse, Rajendra ; Tam, Samuel ; Ahmad, Nazir  

Agent name :

 

Address for service :

 

Filing date :

25 February 2002  

Associated companies :

 

Applicant name :

CHIPPAC, INC.  

Applicant address :

47400 Kato Road, Fremont, CA 94538  

Old name :

 

Original Source :

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