Details
- Application number :
- 2002252088
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Super-thin high speed flip chip package
- Inventor :
- Tam, Samuel
;
Pendse, Rajendra
- Agent name :
-
- Address for service :
-
- Filing date :
- 26 February 2002
- Associated companies :
-
- Applicant name :
- CHIPPAC, INC.
- Applicant address :
- 47400 Kato Road, Fremont, CA 94538
- Old name :
-
- Original Source :
- Go