Metallization for high power handling in a surface acoustic wave device and method for providing same
A Standard patent application filed on 01 December 1999 credited to Lai, Shouliang
Details
Application number :
20344
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Metallization for high power handling in a surface acoustic wave device and method for providing same