Notch-free etching of high aspect soi structures using alternating deposition and etching and pulsed plasma
A Standard patent application filed on 10 July 2003 credited to Johnson, David
;
Lai, Shouliang
;
Westerman, Russell
Details
Application number :
2003283060
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Notch-free etching of high aspect soi structures using alternating deposition and etching and pulsed plasma
Inventor :
Johnson, David
;
Lai, Shouliang
;
Westerman, Russell