Microelectronic packages including reactive components, and methods of fabricating the same
A Standard patent application filed on 21 June 2001 credited to Mahadevan, Ramaswamy

Details

Application number :

2001274414  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Microelectronic packages including reactive components, and methods of fabricating the same  

Inventor :

Mahadevan, Ramaswamy  

Agent name :

 

Address for service :

 

Filing date :

21 June 2001  

Associated companies :

 

Applicant name :

Jds Uniphase Corporation  

Applicant address :

 

Old name :

 

Original Source :

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