Temperature compensated microelectromechanical structures and methods of compensating the effects of ambient temperature variations
A Standard patent application filed on 21 February 2000 credited to Hill, Edward ; Mahadevan, Ramaswamy ; Wood, Robert L.

Details

Application number :

37029  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Temperature compensated microelectromechanical structures and methods of compensating the effects of ambient temperature variations  

Inventor :

Hill, Edward ; Mahadevan, Ramaswamy ; Wood, Robert L.  

Agent name :

 

Address for service :

 

Filing date :

21 February 2000  

Associated companies :

 

Applicant name :

Cronos Integrated Microsystems, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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