Methods of bonding two aluminum-comprising masses to one another, methods of bonding a physical vapor deposition target material to backing plate material, and structures comprising aluminum-comprising physical vapor deposition targets and backing plates
A Standard patent application filed on 08 March 2001 credited to Kim, Jaeyeon

Details

Application number :
2001249113  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Methods of bonding two aluminum-comprising masses to one another, methods of bonding a physical vapor deposition target material to backing plate material, and structures comprising aluminum-comprising physical vapor deposition targets and backing plates  
Inventor :
Kim, Jaeyeon  
Agent name :
 
Address for service :
 
Filing date :
08 March 2001  
Associated companies :
 
Applicant name :
Honeywell International, Inc.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor