Resilient interconnect structure for electronic components and method for makingthe same
A Standard patent application filed on 27 December 2000 credited to Mathieu, Gaetan L ; Larder, Richard A. ; Grube, Gary W ; Eldridge, Benjamin N

Details

Application number :

27406  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Resilient interconnect structure for electronic components and method for makingthe same  

Inventor :

Mathieu, Gaetan L ; Larder, Richard A. ; Grube, Gary W ; Eldridge, Benjamin N  

Agent name :

 

Address for service :

 

Filing date :

27 December 2000  

Associated companies :

 

Applicant name :

FormFactor, Inc.  

Applicant address :

 

Old name :

 

Original Source :

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