Interconnect for microelectronic structures with enhanced spring characteristics
A Standard patent application filed on 27 December 2000 credited to Eldridge, Benjamin N ; Mathieu, Gaetan L

Details

Application number :

26036  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Interconnect for microelectronic structures with enhanced spring characteristics  

Inventor :

Eldridge, Benjamin N ; Mathieu, Gaetan L  

Agent name :

 

Address for service :

 

Filing date :

27 December 2000  

Associated companies :

 

Applicant name :

FormFactor, Inc.  

Applicant address :

 

Old name :

 

Original Source :

Go  

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