Method and system for reducing damage to substrates during plasma processing with a resonator source
A Standard patent application filed on 20 December 2000 credited to Sirkis, Murray D. ; Johnson, Wayne L.

Details

Application number :
25770  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method and system for reducing damage to substrates during plasma processing with a resonator source  
Inventor :
Sirkis, Murray D. ; Johnson, Wayne L.  
Agent name :
 
Address for service :
 
Filing date :
20 December 2000  
Associated companies :
 
Applicant name :
Tokyo Electron Limited  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor