A method of wafer band-edge measurement using transmission spectroscopy and a process for controlling the temperature uniformity of a wafer
A Standard patent application filed on 05 January 2001 credited to Denton, Medona B. ; Sirkis, Murray D. ; Johnson, Wayne L.

Details

Application number :

30841  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A method of wafer band-edge measurement using transmission spectroscopy and a process for controlling the temperature uniformity of a wafer  

Inventor :

Denton, Medona B. ; Sirkis, Murray D. ; Johnson, Wayne L.  

Agent name :

 

Address for service :

 

Filing date :

05 January 2001  

Associated companies :

 

Applicant name :

Tokyo Electron Limited  

Applicant address :

 

Old name :

 

Original Source :

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