Multilayer printed wiring board and method of manufacturing the same
A Standard patent application filed on 21 December 2000 credited to Saijo, Kinji ; Yoshida, Kazuo ; Okamoto, Hiroaki ; Ohsawa, Shinji

Details

Application number :
23990  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Multilayer printed wiring board and method of manufacturing the same  
Inventor :
Saijo, Kinji ; Yoshida, Kazuo ; Okamoto, Hiroaki ; Ohsawa, Shinji  
Agent name :
 
Address for service :
 
Filing date :
21 December 2000  
Associated companies :
 
Applicant name :
Toyo Kohan Co. Ltd.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor