Details

Application number :
52466  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them  
Inventor :
Saijo, Kinji ; Ohsawa, Shinji ; Okamoto, Hiroaki ; Yoshida, Kazuo  
Agent name :
 
Address for service :
 
Filing date :
09 June 2000  
Associated companies :
 
Applicant name :
Toyo Kohan Co. Ltd.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor