In situ post-etch photoresist and polymer stripping and dielectric etch chamber cleaning
A Standard patent application filed on 19 December 2000 credited to Collison, Wenli ; Ni, Tuquiang

Details

Application number :
22823  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
In situ post-etch photoresist and polymer stripping and dielectric etch chamber cleaning  
Inventor :
Collison, Wenli ; Ni, Tuquiang  
Agent name :
 
Address for service :
 
Filing date :
19 December 2000  
Associated companies :
 
Applicant name :
Lam Research Corporation  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor