Details

Application number :
74474  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Substrate for electronic packaging, pin jig fixture  
Inventor :
Mirsky, Uri ; Neftin, Shimon  
Agent name :
 
Address for service :
 
Filing date :
20 May 1998  
Associated companies :
 
Applicant name :
Micro Components Ltd.  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor