Liquid curable resin composition
A Standard patent application filed on 20 January 1998 credited to Hirai, Tsuyoshi ; Ukachi, Takashi ; Komiya, Zen ; Kikuchi, Toshikazu

Details

Application number :
55789  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Liquid curable resin composition  
Inventor :
Hirai, Tsuyoshi ; Ukachi, Takashi ; Komiya, Zen ; Kikuchi, Toshikazu  
Agent name :
 
Address for service :
 
Filing date :
20 January 1998  
Associated companies :
 
Applicant name :
DSM N.V.  
Applicant address :
 
Old name :
 
Original Source :
Go  

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