Liquid curable resin composition
A Standard patent application filed on 29 September 2003 credited to Takahashi, Atsuya ; Komiya, Zen ; Ukon, Masakatsu ; Yoshizawa, Junji

Details

Application number :
2003266675  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Liquid curable resin composition  
Inventor :
Takahashi, Atsuya ; Komiya, Zen ; Ukon, Masakatsu ; Yoshizawa, Junji  
Agent name :
 
Address for service :
 
Filing date :
29 September 2003  
Associated companies :
 
Applicant name :
DSM IP ASSETS B.V.  
Applicant address :
Het Overloon 1 NL-6411 TE Heerlen Netherlands  
Old name :
 
Original Source :
Go  

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