A packaging structure for integrated circuits
A Standard patent application filed on 19 December 1997 credited to Hesselbom, Hjalmar

Details

Application number :
55060  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
A packaging structure for integrated circuits  
Inventor :
Hesselbom, Hjalmar  
Agent name :
 
Address for service :
 
Filing date :
19 December 1997  
Associated companies :
 
Applicant name :
Telefonaktiebolaget LM Ericsson (PUBL)  
Applicant address :
 
Old name :
 
Original Source :
Go  

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