A ball grid array structure and method for packaging an integrated circuit chip
A Standard patent application filed on 17 October 1996 credited to Lan, James J. D. ; Chiang, Steve S. ; Jiang, Hang ; Shepherd, William H. ; Xie, John Y. ; Wu, Paul Y. F.

Details

Application number :

74598  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A ball grid array structure and method for packaging an integrated circuit chip  

Inventor :

Lan, James J. D. ; Chiang, Steve S. ; Jiang, Hang ; Shepherd, William H. ; Xie, John Y. ; Wu, Paul Y. F.  

Agent name :

 

Address for service :

 

Filing date :

17 October 1996  

Associated companies :

 

Applicant name :

Prolinx Labs Corporation  

Applicant address :

 

Old name :

 

Original Source :

Go