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Waterproof structure for conductor leading part
A Standard patent application filed on 24 December 1997 credited to Kato, Tetsuo ; Shinchi, Akira ; Asakura, Nobuyuki
Details
Application number :
49274
Application type :
Standard
Application status :
SEALED
Under opposition :
No
Proceeding type :
Invention title :
Waterproof structure for conductor leading part
Inventor :
Kato, Tetsuo ; Shinchi, Akira ; Asakura, Nobuyuki
Agent name :
SPRUSON & FERGUSON
Address for service :
GPO Box 3898 SYDNEY NSW 2001
Filing date :
24 December 1997
Associated companies :
Applicant name :
Yazaki Corporation
Applicant address :
1-4-28 Mita Minato-ku Tokyo 108 Japan
Old name :
Original Source :
Go
Same Inventor
Connection structure of a covered wire with resin encapsulation
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