Connection structure of a covered wire with resin encapsulation
A Standard patent application filed on 24 October 1997 credited to Kato, Tetsuo ; Ide, Tetsuro ; Shinchi, Akira ; Asakura, Nobuyuki

Details

Application number :

42854  

Application type :

Standard  

Application status :

SEALED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Connection structure of a covered wire with resin encapsulation  

Inventor :

Kato, Tetsuo ; Ide, Tetsuro ; Shinchi, Akira ; Asakura, Nobuyuki  

Agent name :

SPRUSON & FERGUSON  

Address for service :

GPO Box 3898 SYDNEY NSW 2001  

Filing date :

24 October 1997  

Associated companies :

 

Applicant name :

Yazaki Corporation  

Applicant address :

1-4-28 Mita Minato-ku Tokyo 108 Japan  

Old name :

 

Original Source :

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