Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material
A Standard patent application filed on 17 November 2000 credited to Nienhaus, Matthias ; Schmitz, Felix

Details

Application number :

13950  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material  

Inventor :

Nienhaus, Matthias ; Schmitz, Felix  

Agent name :

 

Address for service :

 

Filing date :

17 November 2000  

Associated companies :

 

Applicant name :

Institut Fur Mikrotechnik Mainz GmbH  

Applicant address :

 

Old name :

 

Original Source :

Go  

Same Inventor

• Flat coil and lithographic method for producing microcomponents